Accumulation of Defects in Polycrystalline Copper-Aluminum Solid Solutions and the Role of Stacking Fault Energy; Bulletin of the Russian Academy of Sciences: Physics; Vol. 85, iss. 9

Détails bibliographiques
Parent link:Bulletin of the Russian Academy of Sciences: Physics
Vol. 85, iss. 9.— 2021.— [P. 937-940]
Collectivité auteur: Национальный исследовательский Томский политехнический университет Школа базовой инженерной подготовки Отделение естественных наук
Autres auteurs: Koneva N. A. Nina Aleksandrovna, Trishkina L. I. Lyudmila Iljinichna, Cherkasova T. V. Tatyana Viktorovna, Popova N. A. Nataljya Anatoljevna, Cherkasov N. V. Nikita Vladislavovich
Résumé:Title screen
Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established.
Режим доступа: по договору с организацией-держателем ресурса
Langue:anglais
Publié: 2021
Sujets:
Accès en ligne:https://doi.org/10.3103/S1062873821090197
Format: Électronique Chapitre de livre
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=666682

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