Accumulation of Defects in Polycrystalline Copper-Aluminum Solid Solutions and the Role of Stacking Fault Energy; Bulletin of the Russian Academy of Sciences: Physics; Vol. 85, iss. 9

Accumulation of Defects in Polycrystalline Copper-Aluminum Solid Solutions and the Role of Stacking Fault Energy; Bulletin of the Russian Academy of Sciences: Physics; Vol. 85, iss. 9

Chi tiết về thư mục
Parent link:	Bulletin of the Russian Academy of Sciences: Physics Vol. 85, iss. 9.— 2021.— [P. 937-940]
Tác giả của công ty:	Национальный исследовательский Томский политехнический университет Школа базовой инженерной подготовки Отделение естественных наук
Tác giả khác:	Koneva N. A. Nina Aleksandrovna, Trishkina L. I. Lyudmila Iljinichna, Cherkasova T. V. Tatyana Viktorovna, Popova N. A. Nataljya Anatoljevna, Cherkasov N. V. Nikita Vladislavovich
Tóm tắt:	Title screen Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established. Режим доступа: по договору с организацией-держателем ресурса
Ngôn ngữ:	Tiếng Anh
Được phát hành:	2021
Những chủ đề:	электронный ресурс труды учёных ТПУ дефекты поликристаллы медь-алюминий электронная микроскопия пластические деформации
Truy cập trực tuyến:	https://doi.org/10.3103/S1062873821090197
Định dạng:	Điện tử Chương của sách
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=666682

Internet

https://doi.org/10.3103/S1062873821090197