Accumulation of Defects in Polycrystalline Copper-Aluminum Solid Solutions and the Role of Stacking Fault Energy

Accumulation of Defects in Polycrystalline Copper-Aluminum Solid Solutions and the Role of Stacking Fault Energy

Bibliographic Details
Parent link:Bulletin of the Russian Academy of Sciences: Physics
Vol. 85, iss. 9.— 2021.— [P. 937-940]
Corporate Author: Национальный исследовательский Томский политехнический университет Школа базовой инженерной подготовки Отделение естественных наук
Other Authors: Koneva N. A. Nina Aleksandrovna, Trishkina L. I. Lyudmila Iljinichna, Cherkasova T. V. Tatyana Viktorovna, Popova N. A. Nataljya Anatoljevna, Cherkasov N. V. Nikita Vladislavovich
Summary:Title screen
Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established.
Режим доступа: по договору с организацией-держателем ресурса
Language:English
Published: 2021
Subjects:
электронный ресурс
труды учёных ТПУ
дефекты
поликристаллы
медь-алюминий
электронная микроскопия
пластические деформации
Online Access:https://doi.org/10.3103/S1062873821090197
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=666682

Internet

https://doi.org/10.3103/S1062873821090197

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