Accumulation of Defects in Polycrystalline Copper-Aluminum Solid Solutions and the Role of Stacking Fault Energy; Bulletin of the Russian Academy of Sciences: Physics; Vol. 85, iss. 9
| Parent link: | Bulletin of the Russian Academy of Sciences: Physics Vol. 85, iss. 9.— 2021.— [P. 937-940] |
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| Müşterek Yazar: | |
| Diğer Yazarlar: | , , , , |
| Özet: | Title screen Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established. Режим доступа: по договору с организацией-держателем ресурса |
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
2021
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| Konular: | |
| Online Erişim: | https://doi.org/10.3103/S1062873821090197 |
| Materyal Türü: | Elektronik Kitap Bölümü |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=666682 |
| Özet: | Title screen Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established. Режим доступа: по договору с организацией-держателем ресурса |
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| DOI: | 10.3103/S1062873821090197 |