Accumulation of Defects in Polycrystalline Copper-Aluminum Solid Solutions and the Role of Stacking Fault Energy
| Parent link: | Bulletin of the Russian Academy of Sciences: Physics Vol. 85, iss. 9.— 2021.— [P. 937-940] |
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| निगमित लेखक: | |
| अन्य लेखक: | , , , , |
| सारांश: | Title screen Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established. Режим доступа: по договору с организацией-держателем ресурса |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2021
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| विषय: | |
| ऑनलाइन पहुंच: | https://doi.org/10.3103/S1062873821090197 |
| स्वरूप: | इलेक्ट्रोनिक पुस्तक अध्याय |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=666682 |
| सारांश: | Title screen Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established. Режим доступа: по договору с организацией-держателем ресурса |
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| डिजिटल ऑब्जेक्ट पहचानकर्ता: | 10.3103/S1062873821090197 |