Estimation of Thermal Resistance Field in Layered Materials by Analytical Asymptotic Method; Applied Sciences; Vol. 10, iss. 7

Detalhes bibliográficos
Parent link:Applied Sciences
Vol. 10, iss. 7.— 2020.— [2351,11 p.]
Autor Corporativo: Национальный исследовательский Томский политехнический университет Инженерная школа неразрушающего контроля и безопасности Центр промышленной томографии Международная научно-образовательная лаборатория неразрушающего контроля
Outros Autores: Groz M. M. Marie-Marthe, Bensalem M., Sommier A., Abisset-Chavanne E., Chevalier S., Chulkov A. O. Arseniy Olegovich, Battaglia J. L., Batsale J. Ch. Jean Christophe, Pradere Ch. Christophe
Resumo:Title screen
In this paper, the problem of the quantitative characterization of thermal resistance fields in a multilayer sample is addressed by using the classical front face flash method as the thermal excitation and infrared thermography (IRT) as the monitoring sensor. In this challenging problem, the complete inverse processing of a multilayer analytical model is difficult due to the lack of sensitivity of some parameters (layer thickness, depth of thermal resistance, etc.) and the expansive computational iterative processing. For these reasons, the proposed strategy is to use a simple multilayer problem where only one resistive layer is estimated. Moreover, to simplify the inverse processing often based on iterative methods, an asymptotic development method is proposed here. Regarding the thermal signal reconstruction (TSR) methods, the drawback of these methods is the inability to be quantitative. To overcome this problem, the method incorporates a calibration process originating from the complete analytical quadrupole solution to the thermal problem. This analytical knowledge allows self-calibration of the asymptotic method. From this calibration, the quantitative thermal resistance field of a sample can be retrieved with a reasonable accuracy lower than 5%.
Idioma:inglês
Publicado em: 2020
Assuntos:
Acesso em linha:http://earchive.tpu.ru/handle/11683/68965
https://doi.org/10.3390/app10072351
Formato: Recurso Electrónico Capítulo de Livro
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=665406