Self-Aligned Multilayer Dielectric “DummyGate” Technology for L–, S– and X–Band GaAsMMICs Fabrication; Micro/Nanosystems Technologies, MNST'2010

Bibliografische gegevens
Parent link:Micro/Nanosystems Technologies, MNST'2010.— 2010.— [P. 37-40]
Andere auteurs: Anishchenko E. V. Ekaterina, Arykov V. S. Vadim, Gavrilova A. M. Anastasiya, Dedkova O. A. Olga, Kagadei V. A. Valery, Kamchatnaya O. V. Oksana Valerievna, Lilenko Yu. V. Yury, Yushenko A. Yu. Aleksey
Samenvatting:Title screen
This paper demonstrates the main aspects of thetechnology for GaAs microwave monolithic integrated circuits fabrication. The self-aligned technology with multilayerdielectric “dummy gate” used for fabrication of the metal–semiconductor field effect transistor with 0.5 microns gatelength and ion implantation for channel, drain and sourceregions formation is described. Methods of front- and backside processing and specifications of control MMICs such asL–, S– and X–band switches, attenuators and phase-shiftersare described
Режим доступа: по договору с организацией-держателем ресурса
Taal:Engels
Gepubliceerd in: 2010
Onderwerpen:
Online toegang:https://doi.org/10.1109/MNST.2010.5687133
Formaat: Elektronisch Hoofdstuk
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=664901

MARC

LEADER 00000naa0a2200000 4500
001 664901
005 20250815101558.0
035 |a (RuTPU)RU\TPU\network\36086 
035 |a RU\TPU\network\7228 
090 |a 664901 
100 |a 20210528d2010 k||y0engy50 ba 
101 0 |a eng 
135 |a drcn ---uucaa 
181 0 |a i  
182 0 |a b 
200 1 |a Self-Aligned Multilayer Dielectric “DummyGate” Technology for L–, S– and X–Band GaAsMMICs Fabrication  |f E. V. Anishchenko, V. S. Arykov, A. M. Gavrilova [et al.] 
203 |a Text  |c electronic 
300 |a Title screen 
320 |a [References: p. 40 (3 tit.)] 
330 |a This paper demonstrates the main aspects of thetechnology for GaAs microwave monolithic integrated circuits fabrication. The self-aligned technology with multilayerdielectric “dummy gate” used for fabrication of the metal–semiconductor field effect transistor with 0.5 microns gatelength and ion implantation for channel, drain and sourceregions formation is described. Methods of front- and backside processing and specifications of control MMICs such asL–, S– and X–band switches, attenuators and phase-shiftersare described 
333 |a Режим доступа: по договору с организацией-держателем ресурса 
463 |t Micro/Nanosystems Technologies, MNST'2010  |o proceedings of the 2nd Russia School and Seminar on Fundamental Problems, 9-11 December 2010, Novosibirsk, Russia  |v [P. 37-40]  |d 2010 
610 1 |a электронный ресурс 
610 1 |a труды учёных ТПУ 
610 1 |a gallium arsenide 
610 1 |a ion implantation 
610 1 |a dummy gate 
610 1 |a MESFET 
610 1 |a AESA 
610 1 |a ионная имплантация 
701 1 |a Anishchenko  |b E. V.  |g Ekaterina 
701 1 |a Arykov  |b V. S.  |g Vadim 
701 1 |a Gavrilova  |b A. M.  |g Anastasiya 
701 1 |a Dedkova  |b O. A.  |g Olga 
701 1 |a Kagadei  |b V. A.  |g Valery 
701 1 |a Kamchatnaya  |b O. V.  |c specialist in the field of material science  |c Associate Professor of Tomsk Polytechnic University, Candidate of chemical sciences  |f 1984-  |g Oksana Valerievna  |3 (RuTPU)RU\TPU\pers\46876  |9 22498 
701 1 |a Lilenko  |b Yu. V.  |g Yury 
701 1 |a Yushenko  |b A. Yu.  |g Aleksey 
801 2 |a RU  |b 63413507  |c 20210528  |g RCR 
856 4 |u https://doi.org/10.1109/MNST.2010.5687133 
942 |c CF