The properties of Cu films deposited by high rate magnetron sputtering from a liquid target; Vacuum; Vol. 169

The properties of Cu films deposited by high rate magnetron sputtering from a liquid target; Vacuum; Vol. 169

Bibliographische Detailangaben
Parent link:Vacuum
Vol. 169.— 2019.— [108914, 9 p.]
Körperschaft: Национальный исследовательский Томский политехнический университет Инженерная школа ядерных технологий Научно-образовательный центр Б. П. Вейнберга
Weitere Verfasser: Bleykher (Bleicher) G. A. Galina Alekseevna, Yuryeva A. V. Alena Victorovna, Shabunin A. S. Artem Sergeevich, Sidelev D. V. Dmitry Vladimirovich, Grudinin V. A. Vladislav Alekseevich, Yuriev Yu. N. Yuri Nikolaevich
Zusammenfassung:Title screen
The focus of the paper is Cu films obtained by magnetron sputtering a liquid target at an average power density not exceeding 45 W/cm2. The deposition rates reached 140 nm/s. In the film formation, the pulsed power supplies of two types have been used. The discharge has functioned in an Ar atmosphere and in self-sustained mode. Structural and electrically conductive properties of the films have been analyzed. A comparison was made with those deposited by sputtering a cooled target with similar power. It has revealed that the evaporation of the magnetron target plays a dominant role in the formation of the structural and conductive properties of Cu films. The Cu films deposited by sputtering evaporative liquid targets have a lower electrical resistance than the films of similar thickness obtained by sputtering cooled targets. The mode of self-sustained sputtering does not significantly affect the structural properties of the films as compared with sputtering in the Ar atmosphere, but the electrical resistivity is approximately 20% lower. Due to high deposition rate in the case with evaporative targets the heating of the substrate when producing films of equal thickness turns out to be less than when using a magnetron with a cooled target.
Режим доступа: по договору с организацией-держателем ресурса
Sprache:Englisch
Veröffentlicht: 2019
Schlagworte:
электронный ресурс
труды учёных ТПУ
magnetron sputtering systems
liquid-phase sputtering
evaporation
self-sustained sputtering
Cu films and coatings
Cu films electrical resistance
магнетронные распылительные системы
выпаривание
распыление
пленки
покрытия
электрическое сопротивление
Online-Zugang:https://doi.org/10.1016/j.vacuum.2019.108914
Format: Elektronisch Buchkapitel
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=661062

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