The Grain Boundary Diffusion of Silicon in Nickel Titanium under External Energy Deposition Alexey; AIP Conference Proceedings; Vol. 2051 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2018 (AMHS’18)

Detalles Bibliográficos
Parent link:AIP Conference Proceedings
Vol. 2051 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2018 (AMHS’18).— 2018.— [020188, 4 p.]
Autor Corporativo: Национальный исследовательский Томский политехнический университет Инженерная школа новых производственных технологий Отделение материаловедения
Outros autores: Maslov A. Alexey, Kryukova O. Olga, Knyazeva A. G. Anna Georgievna, Bukrina N. Natalya
Summary:Title screen
This paper presents a model of surface modification of nickel titanium specimen by electron beam. Chemical reactions were taken into account in the framework of a simple kinetic scheme and the difference in diffusion coefficients in nickel titanium volume and its boundary. The dynamics of formation of the reaction product with increasing temperature and diffusion of silicon into the specimen was investigated. Non-uniform phase formation, which leads to a complication of the heterogeneous structure of the titanium nickelide surface, was demonstrated.
Режим доступа: по договору с организацией-держателем ресурса
Idioma:inglés
Publicado: 2018
Subjects:
Acceso en liña:https://doi.org/10.1063/1.5083431
Formato: Electrónico Capítulo de libro
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=659198