Scratch Testing of Coarse-Grained and Ultra Fine-Grained Copper; AIP Conference Proceedings; Vol. 2051 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2018 (AMHS’18)
| Parent link: | AIP Conference Proceedings Vol. 2051 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2018 (AMHS’18).— 2018.— [020086, 4 p.] |
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| Korporace: | , , |
| Další autoři: | , , , , , |
| Shrnutí: | Title screen The influence of a coarse-grained and ultrafine-grained structure of a material obtained by the method of severe plastic deformation on the deformation behavior of copper C11000 when scratching at room temperature is considered. The estimation of the size of the pile-up on the periphery of the scratch, and the dimensions of the groove formed during the process of plowing the material with a spherical indentor was performed. A significant decrease in the volume and maximum depth of the groove is established due to the formation of an ultrafine-grained structure of the material. It is established that the deformation relief on the scratch surface of samples with a UFG structure is more uniform than for samples with a coarse-grained structure. Режим доступа: по договору с организацией-держателем ресурса |
| Jazyk: | angličtina |
| Vydáno: |
2018
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| Témata: | |
| On-line přístup: | https://doi.org/10.1063/1.5083329 |
| Médium: | Elektronický zdroj Kapitola |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=659165 |