Scratch Testing of Coarse-Grained and Ultra Fine-Grained Copper

Bibliographic Details
Parent link:AIP Conference Proceedings
Vol. 2051 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2018 (AMHS’18).— 2018.— [020086, 4 p.]
Corporate Authors: Национальный исследовательский Томский политехнический университет Инженерная школа новых производственных технологий Отделение материаловедения, Национальный исследовательский Томский политехнический университет (ТПУ) Юргинский технологический институт (филиал) (ЮТИ) Отделение промышленных технологий (ОПТ), Национальный исследовательский Томский политехнический университет Инженерная школа ядерных технологий Лаборатория плазменных гибридных систем
Other Authors: Filippov A. V. Andrey Vladimirovich, Tarasov S. Yu. Sergei Yulievich, Fortuna S. V., Podgornykh O. A. Oleg Anatolievich, Shamarin N. N. Nikolay Nikolaevich, Filippova E. O. Ekaterina Olegovna
Summary:Title screen
The influence of a coarse-grained and ultrafine-grained structure of a material obtained by the method of severe plastic deformation on the deformation behavior of copper C11000 when scratching at room temperature is considered. The estimation of the size of the pile-up on the periphery of the scratch, and the dimensions of the groove formed during the process of plowing the material with a spherical indentor was performed. A significant decrease in the volume and maximum depth of the groove is established due to the formation of an ultrafine-grained structure of the material. It is established that the deformation relief on the scratch surface of samples with a UFG structure is more uniform than for samples with a coarse-grained structure.
Режим доступа: по договору с организацией-держателем ресурса
Published: 2018
Subjects:
Online Access:https://doi.org/10.1063/1.5083329
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=659165