Active thermal testing of hyperthermoconductive panels

Active thermal testing of hyperthermoconductive panels

Detalhes bibliográficos
Parent link:Russian Journal of Nondestructive Testing
Vol. 53, iss. 6.— 2017.— [P. 453-456]
Autor Corporativo: Национальный исследовательский Томский политехнический университет (ТПУ) Исследовательская школа физики высокоэнергетических процессов (ИШФВП)
Outros Autores: Simonova O. S. Olga Sergeevna, Chulkov A. O. Arseniy Olegovich, Vavilov V. P. Vladimir Platonovich, Suntsov S. B. Sergey Borisovich
Resumo:Title screen
Application of active infrared thermography to assessing the internal structure and functioning of hyperthermoconductive panels used in on-board electronics is described. Effective thermal- diffusivity maps of hyperthermoconductive panels, obtained using the pulsed Parker method, are presented. The peculiarities of heat transfer in hyperthermoconductive panels are illustrated using experimental modeling in which a local thermal-load source is placed on the surface of hyperthermoconductive panels.
Режим доступа: по договору с организацией-держателем ресурса
Publicado em: 2017
Colecção:Acoustic Methods
Assuntos:
электронный ресурс
труды учёных ТПУ
тепловые трубы
термография
термодиффузия
Acesso em linha:https://doi.org/10.1134/S1061830917060080
Formato: Recurso Electrónico Capítulo de Livro
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=657457

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