Active thermal testing of hyperthermoconductive panels

Active thermal testing of hyperthermoconductive panels

Bibliographic Details
Parent link:Russian Journal of Nondestructive Testing
Vol. 53, iss. 6.— 2017.— [P. 453-456]
Corporate Author: Национальный исследовательский Томский политехнический университет (ТПУ) Исследовательская школа физики высокоэнергетических процессов (ИШФВП)
Other Authors: Simonova O. S. Olga Sergeevna, Chulkov A. O. Arseniy Olegovich, Vavilov V. P. Vladimir Platonovich, Suntsov S. B. Sergey Borisovich
Summary:Title screen
Application of active infrared thermography to assessing the internal structure and functioning of hyperthermoconductive panels used in on-board electronics is described. Effective thermal- diffusivity maps of hyperthermoconductive panels, obtained using the pulsed Parker method, are presented. The peculiarities of heat transfer in hyperthermoconductive panels are illustrated using experimental modeling in which a local thermal-load source is placed on the surface of hyperthermoconductive panels.
Режим доступа: по договору с организацией-держателем ресурса
Published: 2017
Series:Acoustic Methods
Subjects:
электронный ресурс
труды учёных ТПУ
тепловые трубы
термография
термодиффузия
Online Access:https://doi.org/10.1134/S1061830917060080
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=657457

Internet

https://doi.org/10.1134/S1061830917060080

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