Active thermal NDT: problems and solutions; Proceedings of SPIE; Vol. 9861 : Thermosense: Thermal Infrared Applications XXXVIII
| Parent link: | Proceedings of SPIE Vol. 9861 : Thermosense: Thermal Infrared Applications XXXVIII.— 2016.— [98610I, 9 p.] |
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| Riassunto: | Title screen This paper summarizes some common problems of thermal/infrared nondestructive testing and their possible solutions, including optimization of heat source and infrared imager parameters, suppression of additive and multiplicative noise and the use of inversion expressions for estimating defect parameters. © (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only. Режим доступа: по договору с организацией-держателем ресурса |
| Lingua: | inglese |
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2016
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| Serie: | Nondestructive Testing and Composites |
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| Accesso online: | http://dx.doi.org/10.1117/12.2222980 |
| Natura: | Elettronico Capitolo di libro |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=652944 |