[131] Experimental study of the short-circuit robustness of 600 V E-mode GaN transistors; Microelectronics Reliability; Vol. 64 : Proceedings of the 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis

Bibliographic Details
Parent link:Microelectronics Reliability
Vol. 64 : Proceedings of the 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis.— 2016.— [P. 560–565]
Corporate Author: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электрических сетей и электротехники (ЭСиЭ)
Other Authors: Landel M., Gautier C., Labrousse D. Denis, Lefevre S. Stefan
Summary:Title screen
This paper presents experimental robustness of 600 V GaN High Electron Mobility Transistors (HEMT) submitted to Short-Circuits (SC) operation modes. A dedicated secured test bench has been developed and designed in order to protect as quickly as possible the Device Under Test (DUT) after failure. Some devices featured a great robustness under SC and were able to support several SC of a very long duration. On the contrary, others failed immediately at the first pulse, for a low dissipated energy. The obtained results reveal a severe dispersal in terms of SC robustness for these new emerging components. Gate behavior has been also studied, showing a leakage current during each SC, destructive or not. A part of the paper is also dedicated to the study of the effects of case temperature and DC voltage on robustness.
Режим доступа: по договору с организацией-держателем ресурса
Language:English
Published: 2016
Subjects:
Online Access:http://dx.doi.org/10.1016/j.microrel.2016.07.042
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=652464

MARC

LEADER 00000naa0a2200000 4500
001 652464
005 20250902121922.0
035 |a (RuTPU)RU\TPU\network\17774 
035 |a RU\TPU\network\16793 
090 |a 652464 
100 |a 20161227d2016 k||y0rusy50 ba 
101 0 |a eng 
102 |a NL 
135 |a drcn ---uucaa 
181 0 |a i  
182 0 |a b 
200 1 |a [131] Experimental study of the short-circuit robustness of 600 V E-mode GaN transistors  |f M. Landel [et al.] 
203 |a Text  |c electronic 
300 |a Title screen 
320 |a [References: p. 565 (7 tit.)] 
330 |a This paper presents experimental robustness of 600 V GaN High Electron Mobility Transistors (HEMT) submitted to Short-Circuits (SC) operation modes. A dedicated secured test bench has been developed and designed in order to protect as quickly as possible the Device Under Test (DUT) after failure. Some devices featured a great robustness under SC and were able to support several SC of a very long duration. On the contrary, others failed immediately at the first pulse, for a low dissipated energy. The obtained results reveal a severe dispersal in terms of SC robustness for these new emerging components. Gate behavior has been also studied, showing a leakage current during each SC, destructive or not. A part of the paper is also dedicated to the study of the effects of case temperature and DC voltage on robustness. 
333 |a Режим доступа: по договору с организацией-держателем ресурса 
461 1 |t Microelectronics Reliability 
463 1 |t Vol. 64 : Proceedings of the 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis  |v [P. 560–565]  |d 2016 
610 1 |a электронный ресурс 
610 1 |a труды учёных ТПУ 
610 1 |a короткое замыкание 
610 1 |a испытательные стенды 
610 1 |a надежность 
610 1 |a колебания 
610 1 |a транзисторы 
610 1 |a робастность 
701 1 |a Landel  |b M. 
701 1 |a Gautier  |b C. 
701 1 |a Labrousse  |b D.  |g Denis 
701 1 |a Lefevre  |b S.  |c specialist in the field of electrical engineering  |c Professor of Tomsk Polytechnic University  |f 1968-  |g Stefan  |3 (RuTPU)RU\TPU\pers\36636 
712 0 2 |a Национальный исследовательский Томский политехнический университет (ТПУ)  |b Энергетический институт (ЭНИН)  |b Кафедра электрических сетей и электротехники (ЭСиЭ)  |3 (RuTPU)RU\TPU\col\18677 
801 2 |a RU  |b 63413507  |c 20161227  |g RCR 
856 4 |u http://dx.doi.org/10.1016/j.microrel.2016.07.042 
942 |c CF