[131] Experimental study of the short-circuit robustness of 600 V E-mode GaN transistors

Bibliographic Details
Parent link:Microelectronics Reliability
Vol. 64 : Proceedings of the 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis.— 2016.— [P. 560–565]
Corporate Author: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электрических сетей и электротехники (ЭСиЭ)
Other Authors: Landel M., Gautier C., Labrousse D. Denis, Lefevre S. Stefan
Summary:Title screen
This paper presents experimental robustness of 600 V GaN High Electron Mobility Transistors (HEMT) submitted to Short-Circuits (SC) operation modes. A dedicated secured test bench has been developed and designed in order to protect as quickly as possible the Device Under Test (DUT) after failure. Some devices featured a great robustness under SC and were able to support several SC of a very long duration. On the contrary, others failed immediately at the first pulse, for a low dissipated energy. The obtained results reveal a severe dispersal in terms of SC robustness for these new emerging components. Gate behavior has been also studied, showing a leakage current during each SC, destructive or not. A part of the paper is also dedicated to the study of the effects of case temperature and DC voltage on robustness.
Режим доступа: по договору с организацией-держателем ресурса
Published: 2016
Subjects:
Online Access:http://dx.doi.org/10.1016/j.microrel.2016.07.042
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=652464