Microstructure and Properties of the Composite on the Basis of Copper and Diamond

Microstructure and Properties of the Composite on the Basis of Copper and Diamond

Bibliographic Details
Parent link:Key Engineering Materials: Scientific Journal
Vol. 685 : High Technology: Research and Applications 2015 (HTRA 2015).— 2016.— [P. 607-610]
Main Author: Ivashutenko A. S. Alexander Sergeevich
Corporate Authors: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП), Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Кафедра материаловедения и технологии металлов (МТМ)
Other Authors: Martyushev N. V. Nikita Vladimirovich, Drozdov Yu. Yu. Yury Yurievich
Summary:Title screen
The paper presents the experimental material on obtaining and researching of three-dimensional composite heat-conducting copper-diamond materials in the system of spark plasma sintering. Earlier [1-5], it was established that in order to achieve the effect of the increased heat conductivity of a composite it is necessary to create the conditions hindering the movement of heat flux on the interface boundary. In this work we have attempted to obtain the material with heat conductivity higher than that of pure copper due to addition of diamond powder and synthesis of the composite in the system of spark plasma sintering. For comparison, we have considered copper and diamond compositions in the ratios of 50/50 and 40/60 correspondingly. The results of the heat conductivity analysis have not exceeded the indices of pure copper; however, according to SEM data, it has been found that at SPS-sintering local domains with enhanced adhesion form on the surfaces of diamonds.
Режим доступа: по договору с организацией-держателем ресурса
Language:English
Published: 2016
Series:Advanced Materials and Alloys, Nanomaterials and Nanotechnology
Subjects:
электронный ресурс
труды учёных ТПУ
композитные материалы
медь
теплопроводность
алмазы
Online Access:http://dx.doi.org/10.4028/www.scientific.net/KEM.685.607
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=646497

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