Microstructure and Properties of the Composite on the Basis of Copper and Diamond
| Parent link: | Key Engineering Materials: Scientific Journal Vol. 685 : High Technology: Research and Applications 2015 (HTRA 2015).— 2016.— [P. 607-610] |
|---|---|
| Main Author: | |
| Corporate Authors: | , |
| Other Authors: | , |
| Summary: | Title screen The paper presents the experimental material on obtaining and researching of three-dimensional composite heat-conducting copper-diamond materials in the system of spark plasma sintering. Earlier [1-5], it was established that in order to achieve the effect of the increased heat conductivity of a composite it is necessary to create the conditions hindering the movement of heat flux on the interface boundary. In this work we have attempted to obtain the material with heat conductivity higher than that of pure copper due to addition of diamond powder and synthesis of the composite in the system of spark plasma sintering. For comparison, we have considered copper and diamond compositions in the ratios of 50/50 and 40/60 correspondingly. The results of the heat conductivity analysis have not exceeded the indices of pure copper; however, according to SEM data, it has been found that at SPS-sintering local domains with enhanced adhesion form on the surfaces of diamonds. Режим доступа: по договору с организацией-держателем ресурса |
| Language: | English |
| Published: |
2016
|
| Series: | Advanced Materials and Alloys, Nanomaterials and Nanotechnology |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.4028/www.scientific.net/KEM.685.607 |
| Format: | Electronic Book Chapter |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=646497 |