Morphological features of the copper surface layer under sliding with electric current of high density

Morphological features of the copper surface layer under sliding with electric current of high density

Dades bibliogràfiques
Parent link:	Перспективные материалы с иерархической структурой для новых технологий и надежных конструкций: тезисы докладов Международной конференции, 21-25 сентября 2015 г., Томск/ Российская академия наук (РАН), Сибирское отделение (СО), Институт физики прочности и материаловедения (ИФПМ). [С. 279-280].— , 2015
Autor principal:	Aleutdinova M. I.
Autor corporatiu:	Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Кафедра физики высоких технологий в машиностроении (ФВТМ)
Altres autors:	Fadin V. V., Rubtsov V. E. Valery Evgenjevich
Sumari:	Заглавие с экрана
Publicat:	2015
Col·lecció:	Неустойчивость и локализация деформации и разрушения в материалах с иерархической структурой
Matèries:	электронный ресурс труды учёных ТПУ морфологические особенности медь поверхностные слои электрический ток
Accés en línia:	http://www.ispms.ru/files/Conference/2015/tezis_2015.pdf#page=279
Format:	Electrònic Capítol de llibre
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=646053

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