Distribution Functions for Internal Interface Energy as a Characteristic of Submicrocrystalline Copper Structure Evolution under Low-Temperature Annealing; AIP Conference Proceedings; Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures

Distribution Functions for Internal Interface Energy as a Characteristic of Submicrocrystalline Copper Structure Evolution under Low-Temperature Annealing; AIP Conference Proceedings; Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures

Detalles Bibliográficos
Parent link:AIP Conference Proceedings
Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures.— 2015.— [020117, 5 p.]
Autor Corporativo: Национальный исследовательский Томский политехнический университет (ТПУ) Физико-технический институт (ФТИ) Кафедра общей физики (ОФ)
Otros Autores: Kuznetsov P. V. Pavel Viktorovich, Rakhmatulina T., Koznikov A., Belyaeva I.
Sumario:Title screen
Submicrocrystalline structure of 99.99% pure copper produced by equal channel angular pressing was under investigation. After deformation the samples were subjected to low-temperature annealing. Grain and subgrain structure was studied by scanning tunnel microscopy. Internal interface energy was estimated using the method based on measurement of dihedral angles (psi) of the boundary grooves formed by electrochemical etching. Analysis of the differential and cumulative distribution functions for relative grain boundary energy enabled to qualitatively evaluate energy redistribution between the boundaries of different types and internal bulk crystallites and to study evolution of submicrocrystalline structure under low-temperature annealing.
Режим доступа: по договору с организацией-держателем ресурса
Lenguaje:inglés
Publicado: 2015
Materias:
электронный ресурс
труды учёных ТПУ
функции распределения
интерфейсы
энергия
структуры
отжиг
сканирующая туннельная микроскопия
кристаллиты
Acceso en línea:http://dx.doi.org/10.1063/1.4932807
Formato: Electrónico Capítulo de libro
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=644954

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