Distribution Functions for Internal Interface Energy as a Characteristic of Submicrocrystalline Copper Structure Evolution under Low-Temperature Annealing
Parent link: | AIP Conference Proceedings Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures.— 2015.— [020117, 5 p.] |
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Drugi avtorji: | , , , |
Izvleček: | Title screen Submicrocrystalline structure of 99.99% pure copper produced by equal channel angular pressing was under investigation. After deformation the samples were subjected to low-temperature annealing. Grain and subgrain structure was studied by scanning tunnel microscopy. Internal interface energy was estimated using the method based on measurement of dihedral angles (psi) of the boundary grooves formed by electrochemical etching. Analysis of the differential and cumulative distribution functions for relative grain boundary energy enabled to qualitatively evaluate energy redistribution between the boundaries of different types and internal bulk crystallites and to study evolution of submicrocrystalline structure under low-temperature annealing. Режим доступа: по договору с организацией-держателем ресурса |
Jezik: | angleščina |
Izdano: |
2015
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Teme: | |
Online dostop: | http://dx.doi.org/10.1063/1.4932807 |
Format: | Elektronski Book Chapter |
KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=644954 |