Investigation of drop dynamic contact angle on copper surface; European Physical Journal Web of Conferences (EPJ Web of Conferences); Vol. 82 : Thermophysical Basis of Energy Technologies

Investigation of drop dynamic contact angle on copper surface; European Physical Journal Web of Conferences (EPJ Web of Conferences); Vol. 82 : Thermophysical Basis of Energy Technologies

Bibliographic Details
Parent link:European Physical Journal Web of Conferences (EPJ Web of Conferences)
Vol. 82 : Thermophysical Basis of Energy Technologies.— 2015.— [01053, 5 р.]
Main Author: Orlova E. G. Evgeniya Georgievna
Corporate Author: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра теоретической и промышленной теплотехники (ТПТ)
Other Authors: Feoktistov D. V. Dmitriy Vladimirovich, Kuznetsov G. V. Geny Vladimirovich
Summary:Title screen
This paper presents experimental results of the studying the effect of surface roughness, microstructure and flow rate on the dynamic contact angle at spreading of distilled non deaerate water drop on a solid horizontal substrates. Copper substrates with different roughness have been investigated. For each substrate static contact angles depending on volume flow rate have been obtained using shadow system. Increasing the volume flow rate resulted in an increase of the static contact angle. It was found that with increasing surface roughness dynamic contact angle arises. Also difference in formation of the equilibrium contact angle at low and high rates of drop growth has been detected.
Language:English
Published: 2015
Subjects:
электронный ресурс
труды учёных ТПУ
углы
контакты
поверхности
медь
шероховатости
шероховатые поверхности
Online Access:http://dx.doi.org/10.1051/epjconf/20158201053
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=643152

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