Investigation of drop dynamic contact angle on copper surface
| Parent link: | European Physical Journal Web of Conferences (EPJ Web of Conferences) Vol. 82 : Thermophysical Basis of Energy Technologies.— 2015.— [01053, 5 р.] |
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| Автор: | |
| Інші автори: | , |
| Резюме: | Title screen This paper presents experimental results of the studying the effect of surface roughness, microstructure and flow rate on the dynamic contact angle at spreading of distilled non deaerate water drop on a solid horizontal substrates. Copper substrates with different roughness have been investigated. For each substrate static contact angles depending on volume flow rate have been obtained using shadow system. Increasing the volume flow rate resulted in an increase of the static contact angle. It was found that with increasing surface roughness dynamic contact angle arises. Also difference in formation of the equilibrium contact angle at low and high rates of drop growth has been detected. |
| Мова: | Англійська |
| Опубліковано: |
2015
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| Предмети: | |
| Онлайн доступ: | http://dx.doi.org/10.1051/epjconf/20158201053 |
| Формат: | Електронний ресурс Частина з книги |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=643152 |