The influence of the properties of a copper coating deposited on an aluminum contact surface on contact resistance
| Parent link: | Russian Electrical Engineering.— , 2000- Vol. 84, № 8.— 2013.— [P. 418-421] |
|---|---|
| Main Author: | Sivkov A. A. Aleksandr Anatolyevich |
| Corporate Author: | Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП) |
| Other Authors: | Saigash A. S. Anastasiya Sergeevna, Kolganova J. L. Julia Leonidovna |
| Summary: | Title screen The results of experimental studies of the influence of the plasmodynamic deposition conditions of a copper coating on an aluminum contact surface on the contact resistance of an aluminum-copper high-current contact pair with a copper coating are presented. A significant decrease in contact resistance relative to an ordinary contact between aluminum and copper is observed as a result of optimization of the phase composition and structure of the transition layer Режим доступа: по договору с организацией-держателем ресурса |
| Published: |
2013
|
| Subjects: | |
| Online Access: | http://link.springer.com/article/10.3103/S1068371213080129 |
| Format: | Electronic Book Chapter |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637033 |
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