The influence of the properties of a copper coating deposited on an aluminum contact surface on contact resistance

Bibliographic Details
Parent link:Russian Electrical Engineering.— , 2000-
Vol. 84, № 8.— 2013.— [P. 418-421]
Main Author: Sivkov A. A. Aleksandr Anatolyevich
Corporate Author: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП)
Other Authors: Saigash A. S. Anastasiya Sergeevna, Kolganova J. L. Julia Leonidovna
Summary:Title screen
The results of experimental studies of the influence of the plasmodynamic deposition conditions of a copper coating on an aluminum contact surface on the contact resistance of an aluminum-copper high-current contact pair with a copper coating are presented. A significant decrease in contact resistance relative to an ordinary contact between aluminum and copper is observed as a result of optimization of the phase composition and structure of the transition layer
Режим доступа: по договору с организацией-держателем ресурса
Published: 2013
Subjects:
Online Access:http://link.springer.com/article/10.3103/S1068371213080129
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637033