The influence of the properties of a copper coating deposited on an aluminum contact surface on contact resistance; Russian Electrical Engineering; Vol. 84, № 8

Détails bibliographiques
Parent link:Russian Electrical Engineering.— , 2000-
Vol. 84, № 8.— 2013.— [P. 418-421]
Auteur principal: Sivkov A. A. Aleksandr Anatolyevich
Collectivité auteur: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП)
Autres auteurs: Saigash A. S. Anastasiya Sergeevna, Kolganova J. L. Julia Leonidovna
Résumé:Title screen
The results of experimental studies of the influence of the plasmodynamic deposition conditions of a copper coating on an aluminum contact surface on the contact resistance of an aluminum-copper high-current contact pair with a copper coating are presented. A significant decrease in contact resistance relative to an ordinary contact between aluminum and copper is observed as a result of optimization of the phase composition and structure of the transition layer
Режим доступа: по договору с организацией-держателем ресурса
Langue:anglais
Publié: 2013
Sujets:
Accès en ligne:http://link.springer.com/article/10.3103/S1068371213080129
Format: Électronique Chapitre de livre
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637033