Detection of diffusion welding defects by thermal ndt of rectifier elements; The Soviet journal of nondestructive testing; Vol. 19, iss. 5
| Parent link: | The Soviet journal of nondestructive testing.— , 1965- Vol. 19, iss. 5.— 1983.— P. 372-374 |
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| Tác giả khác: | , , , , , |
| Tóm tắt: | Problems of flaw detection in contact joints in rectifier elements (RE) of semiconductor devices are considered investigating the possibility of applying thermal nondestructive testing to such elements. В фонде НТБ ТПУ отсутствует |
| Ngôn ngữ: | Tiếng Anh |
| Được phát hành: |
1983
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| Những chủ đề: | |
| Định dạng: | Chương của sách |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=601416 |
| Tóm tắt: | Problems of flaw detection in contact joints in rectifier elements (RE) of semiconductor devices are considered investigating the possibility of applying thermal nondestructive testing to such elements. В фонде НТБ ТПУ отсутствует |
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