International activity and the forthcoming Conferences in the field of thermal nondestructive testing
| Parent link: | Defektoskopiya № 7.— 2001.— P. 97-99 |
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| Summary: | The aim of the paper is to describe the international activity in the field of thermal nondestructive control. It is noted that the interest in the active thermal testing (ATT), requiring the additional thermal stimulation of the tested objects, increased essentially during last 30 years. The activity of the International Conferences on ATT during last 10 years is described briefly. A list of the forthcoming International Conferences on ATT is given. В фонде НТБ ТПУ отсутствует |
| Published: |
2001
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| Format: | Book Chapter |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=600603 |