Vol. 2. Physics Design - Reliability and Packaging; Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Manylion Llyfryddiaeth
Parent link:Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging/ edited by E. Suhir, Y. C. Lee, C. P. Wong. Vol. 2. Physics Design - Reliability and Packaging.— , 2007-
Iaith:Saesneg
Cyhoeddwyd: 2007
Pynciau:
Fformat: Llyfr
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=140636

Eitemau Tebyg