Vol. 2. Physics Design - Reliability and Packaging

Bibliografske podrobnosti
Parent link:Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging/ edited by E. Suhir, Y. C. Lee, C. P. Wong. Vol. 2. Physics Design - Reliability and Packaging.— , 2007-
Jezik:angleščina
Izdano: 2007
Teme:
Format: Knjiga
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=140636

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