Vol. 2. Physics Design - Reliability and Packaging; Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
| Parent link: | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging/ edited by E. Suhir, Y. C. Lee, C. P. Wong. Vol. 2. Physics Design - Reliability and Packaging.— , 2007- |
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| Iaith: | Saesneg |
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2007
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| Fformat: | Llyfr |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=140636 |