Vol. 2. Physics Design - Reliability and Packaging; Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Detaylı Bibliyografya
Parent link:Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging/ edited by E. Suhir, Y. C. Lee, C. P. Wong. Vol. 2. Physics Design - Reliability and Packaging.— , 2007-
Dil:İngilizce
Baskı/Yayın Bilgisi: 2007
Konular:
Materyal Türü: Kitap
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=140636