Vol. 2. Physics Design - Reliability and Packaging

Bibliographic Details
Parent link:Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging/ edited by E. Suhir, Y. C. Lee, C. P. Wong. Vol. 2. Physics Design - Reliability and Packaging.— , 2007-
Published: 2007
Subjects:
Format: Book
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=140636
Description
Physical Description:735 p. il.
ISBN:0387279741