APA引文

Barbin E. S. Evgeny Sergeevich, Kulinich I. V. Ivan Vladimirovich, Nesterenko T. G. Tamara Georgievna, Koleda A. N. Aleksey Nikolaevich, Shesterikov E. V. Evgeny Viktorovich, Baranov P. F. Pavel Fedorovich, & Ilyashchenko D. P. Dmitry Pavlovich. (2024). Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure; Приборы и методы измерений; Vol 15, No 4. 2024. https://doi.org/10.21122/2220-9506-2024-15-4-323-333

Chicago Style (17th ed.) Citation

Barbin E. S. Evgeny Sergeevich, Kulinich I. V. Ivan Vladimirovich, Nesterenko T. G. Tamara Georgievna, Koleda A. N. Aleksey Nikolaevich, Shesterikov E. V. Evgeny Viktorovich, Baranov P. F. Pavel Fedorovich, and Ilyashchenko D. P. Dmitry Pavlovich. Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure; Приборы и методы измерений; Vol 15, No 4. 2024, 2024. https://doi.org/10.21122/2220-9506-2024-15-4-323-333.

MLA引文

Barbin E. S. Evgeny Sergeevich, et al. Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure; Приборы и методы измерений; Vol 15, No 4. 2024, 2024. https://doi.org/10.21122/2220-9506-2024-15-4-323-333.