APA (7e ed.) Bronvermelding

Barbin E. S. Evgeny Sergeevich, Kulinich I. V. Ivan Vladimirovich, Nesterenko T. G. Tamara Georgievna, Koleda A. N. Aleksey Nikolaevich, Shesterikov E. V. Evgeny Viktorovich, Baranov P. F. Pavel Fedorovich, & Ilyashchenko D. P. Dmitry Pavlovich. (2024). Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure. 2024. https://doi.org/10.21122/2220-9506-2024-15-4-323-333

Chicago (17e ed.) Bronvermelding

Barbin E. S. Evgeny Sergeevich, Kulinich I. V. Ivan Vladimirovich, Nesterenko T. G. Tamara Georgievna, Koleda A. N. Aleksey Nikolaevich, Shesterikov E. V. Evgeny Viktorovich, Baranov P. F. Pavel Fedorovich, en Ilyashchenko D. P. Dmitry Pavlovich. Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure. 2024, 2024. https://doi.org/10.21122/2220-9506-2024-15-4-323-333.

MLA (9e ed.) Bronvermelding

Barbin E. S. Evgeny Sergeevich, et al. Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure. 2024, 2024. https://doi.org/10.21122/2220-9506-2024-15-4-323-333.