Integration of Graphene into Calcium Phosphate Coating for Implant Electronics; ACS Applied Materials and Interfaces; Vol. 17, iss. 9

Bibliografische gegevens
Parent link:ACS Applied Materials and Interfaces.— .— Washington: American Chemical Society
Vol. 17, iss. 9.— 2025.— P. 13527-13537
Andere auteurs: Dogadina Е. М. Elizaveta Maksimovna, Rodriguez (Rodriges) Contreras R. D. Raul David, Fatkullin M. I. Maksim Ilgizovich, Lipovka A. A. Anna Anatolyevna, Kozelskaya A. I. Anna Ivanovna, Averkiev A. A. Andrey Alekseevich, Plotnikov E. V. Evgeny Vladimirovich, Jia Xin, Liu Chaozong, Chen Jin-Ju, Cheng Chong, Que Li, Tverdokhlebov S. I. Sergei Ivanovich, Sheremet E. S. Evgeniya Sergeevna
Samenvatting:Title screen
Bone injuries remain a significant challenge, driving the development of new materials and technologies to enhance healing. This study presents a novel approach for incorporating graphene into calcium phosphate (CaP) coatings on titanium alloy (Ti) substrates, with the aim of creating a new generation of materials for bone implant electronics. The stability of the composite coating under physiological conditions, long-term electrical and mechanical durability, and biocompatibility were systematically investigated. We integrated graphene into the CaP coating through the laser processing of diazonium-functionalized graphene films applied to the surface of CaP-coated Ti. The laser treatment induced several processes, including the removal of aryl groups, the formation of conductive pathways, and chemical bonding with the CaP film. As a result, the graphene–CaP nanocomposite demonstrated excellent mechanical durability, withstanding a 2 h sand abrasion test. It also exhibited excellent biocompatibility, as shown by the proliferation of human fibroblast cells for 7 days. The electrical properties remained stable under physiological conditions for 12 weeks, and the material maintained electrochemical stability after 1 million pulse cycles. Furthermore, it withstood the stress of 100,000 bending cycles without compromising electrical performance. This work highlights the versatility of the biocompatible graphene composite and its potential for a range of applications including free-form electronic circuits, electrodes, bending sensors, and electrothermal heaters
Текстовый файл
AM_Agreement
Taal:Engels
Gepubliceerd in: 2025
Onderwerpen:
Online toegang:https://doi.org/10.1021/acsami.4c21046
Formaat: Elektronisch Hoofdstuk
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=681216
Omschrijving
Samenvatting:Title screen
Bone injuries remain a significant challenge, driving the development of new materials and technologies to enhance healing. This study presents a novel approach for incorporating graphene into calcium phosphate (CaP) coatings on titanium alloy (Ti) substrates, with the aim of creating a new generation of materials for bone implant electronics. The stability of the composite coating under physiological conditions, long-term electrical and mechanical durability, and biocompatibility were systematically investigated. We integrated graphene into the CaP coating through the laser processing of diazonium-functionalized graphene films applied to the surface of CaP-coated Ti. The laser treatment induced several processes, including the removal of aryl groups, the formation of conductive pathways, and chemical bonding with the CaP film. As a result, the graphene–CaP nanocomposite demonstrated excellent mechanical durability, withstanding a 2 h sand abrasion test. It also exhibited excellent biocompatibility, as shown by the proliferation of human fibroblast cells for 7 days. The electrical properties remained stable under physiological conditions for 12 weeks, and the material maintained electrochemical stability after 1 million pulse cycles. Furthermore, it withstood the stress of 100,000 bending cycles without compromising electrical performance. This work highlights the versatility of the biocompatible graphene composite and its potential for a range of applications including free-form electronic circuits, electrodes, bending sensors, and electrothermal heaters
Текстовый файл
AM_Agreement
DOI:10.1021/acsami.4c21046