Thermal analyses of uniformly heated fuel pin cell, inverted cell, and dual surface cooled cell geometries using comsol multi-physics; Научная инициатива иностранных студентов и аспирантов

Dades bibliogràfiques
Parent link:Научная инициатива иностранных студентов и аспирантов.— 2025.— С. 299-304
Autor principal: Odii Ch. J. Christopher Joseph
Altres autors: Korotkikh A. G. Aleksandr Gennadievich (научный руководитель)
Sumari:This study examines the thermal performance of pin cells, inverted cells, and dual surface-cooled cells under high heat conditions. We analysed key thermal properties, including linear heat generation rate and heat flux, by applying a uniform volumetric heat generation rate (VHGR) of 4·107 W/m³ to a pin of length 0.1 m. The results revealed a radial temperature drop of 65 °C for the inverted fuel pin, 26 °C for the normal pin, and 11°C and 13°C for the inner and outer surfaces of the dual surface-cooled pin, respectively. Thus, the dual surface-cooled pin had the lowest thermal loss, while the inverted pin had the highest thermal loss, despite achieving a higher surface temperature than the maximum of the dual surface-cooled pin
Текстовый файл
Idioma:anglès
Publicat: 2025
Matèries:
Accés en línia:http://earchive.tpu.ru/handle/11683/132123
Format: MixedMaterials Electrònic Capítol de llibre
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=681079

MARC

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200 1 |a Thermal analyses of uniformly heated fuel pin cell, inverted cell, and dual surface cooled cell geometries using comsol multi-physics  |f Odii Christopher Joseph  |g sci. adv. Korotkikh A. G. 
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330 |a This study examines the thermal performance of pin cells, inverted cells, and dual surface-cooled cells under high heat conditions. We analysed key thermal properties, including linear heat generation rate and heat flux, by applying a uniform volumetric heat generation rate (VHGR) of 4·107 W/m³ to a pin of length 0.1 m. The results revealed a radial temperature drop of 65 °C for the inverted fuel pin, 26 °C for the normal pin, and 11°C and 13°C for the inner and outer surfaces of the dual surface-cooled pin, respectively. Thus, the dual surface-cooled pin had the lowest thermal loss, while the inverted pin had the highest thermal loss, despite achieving a higher surface temperature than the maximum of the dual surface-cooled pin 
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