Numerical Simulation of Temperature Field Dynamics in Single-Crystal Silicon at Repetitively-Pulsed High-Intensity Ion Implantation and Energy Impact on the Surface Layer; Russian Physics Journal; Vol. 65, iss. 11

Numerical Simulation of Temperature Field Dynamics in Single-Crystal Silicon at Repetitively-Pulsed High-Intensity Ion Implantation and Energy Impact on the Surface Layer; Russian Physics Journal; Vol. 65, iss. 11

التفاصيل البيبلوغرافية
Parent link:	Russian Physics Journal=Известия вузов. Физика.— .— New York: Springer Science+Business Media LLC Vol. 65, iss. 11.— 2023.— P. 1862–1866
مؤلفون آخرون:	Ivanova A. I. Anna Ivanovna, Bleykher (Bleicher) G. A. Galina Alekseevna, Vakhrushev D. O. Dimitry Olegovich, Korneva O. S. Olga Sergeevna
الملخص:	Title screen The surface layer modification of materials and coatings by ion beams is used in many fields of science and technology. The high-intensity implantation by ion beams with high power density and submillisecond duration, implies a significant pulsed heating of the irradiated surface layer, followed by its cooling due to the heat removal deep in the material thanks to its thermal conductivity and the implementation of repetitivelypulsed radiation-enhanced diffusion of atoms to depths exceeding the projective ion range. Based on the numerical simulation, the paper studies the temperature field dynamics in a silicon target at single-pulse and repetitively-pulsed submillisecond ion beams with 109 W/m2 pulsed power density. Temperature conditions are determined for the ion-implanted layer, which correspond to that of the radiation-induced diffusion of implanted elements, while the temperature in the matrix material does not lead to a deterioration of its microstructure and properties Текстовый файл AM_Agreement
اللغة:	الإنجليزية
منشور في:	2023
الموضوعات:	электронный ресурс труды учёных ТПУ Mathematical modeling Temperature gradient Low energy ion High-intensity implantation Silica
الوصول للمادة أونلاين:	https://doi.org/10.1007/s11182-023-02843-1 Статья на русском языке
التنسيق:	الكتروني فصل الكتاب
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=680059

مواد مشابهة

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