Plasma Dynamic Synthesis of Dispersed Cu/SiC Composites with a Controlled Phase Composition
| Parent link: | Metals and Materials International.— .— Seoul: KIM Vol. 30, No. 3.— 2024.— P. 814-831 |
|---|---|
| Corporate Author: | National Research Tomsk Polytechnic University |
| Other Authors: | Shanenkov I. I. Ivan Igorevich, Nikitin D. S. Dmitry Sergeevich, Nassyrbayev (Nasyrbaev) A. Artur, Vympina Yu. N. Yuliya Nikolaevna, Tsimmerman (Cimmerman) A. I. Aleksandr Igorevich, Sivkov A. A. Aleksandr Anatolyevich |
| Summary: | Title screen Obtaining bulk copper-based composite materials with improved physical and mechanical properties often requires pre-treatment of the initial raw materials. Especially it concerns metal matrix composites (MMC) containing copper as a matrix and silicon carbide as a reinforcing component. However, the final properties of Cu/SiC MMC depend on successful solving the problem of silicon solubility in liquid-phase copper during the sintering process. In this work, we demonstrate the possibility of high-energy treatment of copper and silicon carbide by the plasma dynamic method to obtain a pre-activated charge for further sintering. Analytical studies by X-ray diffractomtery (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM) methods testify to the possibility of obtaining highly dispersed composite Cu/SiC materials of different phase and grain size composition depending on the synthesis conditions. The application of polymodal Cu/SiC powders pre-activated by the plasma dynamic method as a charge is established to ensure producing bulk samples by the spark plasma sintering (SPS) method and allow increasing the relative density by ~ 5%–10% and the hardness of the final products by more than 30% compared with pure copper samples produced by the same method AM_Agreement |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://doi.org/10.1007/s12540-023-01533-4 |
| Format: | Electronic Book Chapter |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=672387 |
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