Combined HF+MW CVD Approach for the Growth of Polycrystalline Diamond Films with Reduced Bow; Coatings; Vol. 13, iss. 2

Detalhes bibliográficos
Parent link:Coatings
Vol. 13, iss. 2.— 2023.— [380, 10 p.]
Autor Corporativo: Национальный исследовательский Томский политехнический университет Исследовательская школа физики высокоэнергетических процессов
Outros Autores: Sedov V. Vadim, Popovich A. Alexey, Linnik S. A. Stepan Andreevich, Martyanov A. Artem, Wei J. Junjun, Zenkin S. P. Sergey Petrovich, Zavedeev E. Evgeny, Savin S. Sergey, Gaydaychuk A. V. Alexander Valerievich, Li Ch. Chengming, Ralchenko V. Victor, Konov V. Vitaly
Resumo:Title screen
A combination of two methods of chemical vapor deposition (CVD) of diamond films, microwave plasma–assisted (MW CVD) and hot filament (HF CVD), was used for the growth of 100 µm-thick polycrystalline diamond (PCD) layers on Si substrates. The bow of HF CVD and MW CVD films showed opposite convex\concave trends; thus, the combined material allowed reducing the overall bow by a factor of 2–3. Using MW CVD for the growth of the initial 25 µm-thick PCD layer allowed achieving much higher thermal conductivity of the combined 110 µm-thick film at 210 W/m?K in comparison to 130 W/m?K for the 93 µm-thick pure HF CVD film.
Idioma:inglês
Publicado em: 2023
Assuntos:
Acesso em linha:http://earchive.tpu.ru/handle/11683/74890
https://doi.org/10.3390/coatings13020380
Formato: Recurso Electrónico Capítulo de Livro
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=669256
Descrição
Resumo:Title screen
A combination of two methods of chemical vapor deposition (CVD) of diamond films, microwave plasma–assisted (MW CVD) and hot filament (HF CVD), was used for the growth of 100 µm-thick polycrystalline diamond (PCD) layers on Si substrates. The bow of HF CVD and MW CVD films showed opposite convex\concave trends; thus, the combined material allowed reducing the overall bow by a factor of 2–3. Using MW CVD for the growth of the initial 25 µm-thick PCD layer allowed achieving much higher thermal conductivity of the combined 110 µm-thick film at 210 W/m?K in comparison to 130 W/m?K for the 93 µm-thick pure HF CVD film.
DOI:10.3390/coatings13020380