High-rate magnetron deposition of CuOx films in the metallic mode enhanced by radiofrequency inductively coupled plasma source

High-rate magnetron deposition of CuOx films in the metallic mode enhanced by radiofrequency inductively coupled plasma source

Bibliographische Detailangaben
Parent link:	Vacuum Vol. 207.— 2023.— [111551, 9 p.]
1. Verfasser:	Sidelev D. V. Dmitry Vladimirovich
Körperschaft:	Национальный исследовательский Томский политехнический университет Инженерная школа ядерных технологий Научно-образовательный центр Б. П. Вейнберга
Weitere Verfasser:	Voronina E. D. Ekaterina Dmitrievna, Grudinin V. A. Vladislav Alekseevich
Zusammenfassung:	Title screen The article describes the high-rate deposition of CuOx films by magnetron sputtering system operated in the metallic mode and enhanced by radiofrequency inductively coupled plasma (RF-ICP) source. The role of the RF-ICP assistance on modes of Cu target sputtering in Ar + O2 atmosphere was investigated by determination of hysteresis loops and using optical emission spectroscopy. Then, the CuOx films were deposited on the unmoved substrates depending on their position in the vacuum chamber. The deposition conditions to obtain the CuOx films with some phase and elemental composition were determined. The comparison of the deposition rates of the CuO films is done for the deposition by magnetron sputtering in the metallic mode and using conventional reactive sputtering. Режим доступа: по договору с организацией-держателем ресурса
Veröffentlicht:	2023
Schlagworte:	электронный ресурс труды учёных ТПУ magnetron sputtering high-rate deposition copper oxide thin films radiofrequency inductively coupled plasma (RF-ICP) source
Online-Zugang:	https://doi.org/10.1016/j.vacuum.2022.111551
Format:	Elektronisch Buchkapitel
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=668704

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