High-rate magnetron deposition of CuOx films in the metallic mode enhanced by radiofrequency inductively coupled plasma source
| Parent link: | Vacuum Vol. 207.— 2023.— [111551, 9 p.] |
|---|---|
| Autore principale: | |
| Ente Autore: | |
| Altri autori: | , |
| Riassunto: | Title screen The article describes the high-rate deposition of CuOx films by magnetron sputtering system operated in the metallic mode and enhanced by radiofrequency inductively coupled plasma (RF-ICP) source. The role of the RF-ICP assistance on modes of Cu target sputtering in Ar + O2 atmosphere was investigated by determination of hysteresis loops and using optical emission spectroscopy. Then, the CuOx films were deposited on the unmoved substrates depending on their position in the vacuum chamber. The deposition conditions to obtain the CuOx films with some phase and elemental composition were determined. The comparison of the deposition rates of the CuO films is done for the deposition by magnetron sputtering in the metallic mode and using conventional reactive sputtering. Режим доступа: по договору с организацией-держателем ресурса |
| Lingua: | inglese |
| Pubblicazione: |
2023
|
| Soggetti: | |
| Accesso online: | https://doi.org/10.1016/j.vacuum.2022.111551 |
| Natura: | Elettronico Capitolo di libro |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=668704 |
MARC
| LEADER | 00000naa0a2200000 4500 | ||
|---|---|---|---|
| 001 | 668704 | ||
| 005 | 20260210071611.0 | ||
| 035 | |a (RuTPU)RU\TPU\network\39941 | ||
| 035 | |a RU\TPU\network\39372 | ||
| 090 | |a 668704 | ||
| 100 | |a 20230119d2023 k||y0rusy50 ba | ||
| 101 | 0 | |a eng | |
| 102 | |a SE | ||
| 135 | |a drcn ---uucaa | ||
| 181 | 0 | |a i | |
| 182 | 0 | |a b | |
| 200 | 1 | |a High-rate magnetron deposition of CuOx films in the metallic mode enhanced by radiofrequency inductively coupled plasma source |f D. V. Sidelev, E. D. Voronina, V. A. Grudinin | |
| 203 | |a Text |c electronic | ||
| 300 | |a Title screen | ||
| 320 | |a [References: 30 tit.] | ||
| 330 | |a The article describes the high-rate deposition of CuOx films by magnetron sputtering system operated in the metallic mode and enhanced by radiofrequency inductively coupled plasma (RF-ICP) source. The role of the RF-ICP assistance on modes of Cu target sputtering in Ar + O2 atmosphere was investigated by determination of hysteresis loops and using optical emission spectroscopy. Then, the CuOx films were deposited on the unmoved substrates depending on their position in the vacuum chamber. The deposition conditions to obtain the CuOx films with some phase and elemental composition were determined. The comparison of the deposition rates of the CuO films is done for the deposition by magnetron sputtering in the metallic mode and using conventional reactive sputtering. | ||
| 333 | |a Режим доступа: по договору с организацией-держателем ресурса | ||
| 461 | |t Vacuum | ||
| 463 | |t Vol. 207 |v [111551, 9 p.] |d 2023 | ||
| 610 | 1 | |a электронный ресурс | |
| 610 | 1 | |a труды учёных ТПУ | |
| 610 | 1 | |a magnetron sputtering | |
| 610 | 1 | |a high-rate deposition | |
| 610 | 1 | |a copper oxide | |
| 610 | 1 | |a thin films | |
| 610 | 1 | |a radiofrequency inductively coupled plasma (RF-ICP) source | |
| 700 | 1 | |a Sidelev |b D. V. |c physicist |c Associate Professor of Tomsk Polytechnic University, Candidate of Technical Sciences |f 1991- |g Dmitry Vladimirovich |y Tomsk |3 (RuTPU)RU\TPU\pers\34524 |9 17905 | |
| 701 | 1 | |a Voronina |b E. D. |c specialist in the field of nuclear technologies |c engineer of Tomsk Polytechnic University |f 2000- |g Ekaterina Dmitrievna |3 (RuTPU)RU\TPU\pers\47395 |9 22934 | |
| 701 | 1 | |a Grudinin |b V. A. |c physicist |c engineer of Tomsk Polytechnic University |f 1995- |g Vladislav Alekseevich |3 (RuTPU)RU\TPU\pers\42519 |9 21548 | |
| 712 | 0 | 2 | |a Национальный исследовательский Томский политехнический университет |b Инженерная школа ядерных технологий |b Научно-образовательный центр Б. П. Вейнберга |3 (RuTPU)RU\TPU\col\23561 |9 28358 |
| 801 | 0 | |a RU |b 63413507 |c 20230119 |g RCR | |
| 856 | 4 | |u https://doi.org/10.1016/j.vacuum.2022.111551 | |
| 942 | |c CF | ||