Thermophysical analysis of heat-insulated glued laminated profiled timber for wooden houses; IOP Conference Series: Earth and Environmental Science; Vol. 866 : Sustainable and Efficient Use of Energy, Water and Natural Resources, SEWAN 2021

Thermophysical analysis of heat-insulated glued laminated profiled timber for wooden houses; IOP Conference Series: Earth and Environmental Science; Vol. 866 : Sustainable and Efficient Use of Energy, Water and Natural Resources, SEWAN 2021

Bibliographische Detailangaben
Parent link:IOP Conference Series: Earth and Environmental Science
Vol. 866 : Sustainable and Efficient Use of Energy, Water and Natural Resources, SEWAN 2021.— 2021.— [012037, 8 p.]
Körperschaft: Национальный исследовательский Томский политехнический университет Исследовательская школа химических и биомедицинских технологий
Weitere Verfasser: Tsvetkov N. A., Kolobrodov A. N., Boldyrev S. Stanislav, Romanenko S. V. Sergey Vladimirovich, Nemova T. N. Tatjyana Nikolaevna, Tsvetkov D. N.
Zusammenfassung:Title screen
The paper presents the thermophysical analysis of two types of the wall system made of heat-insulated glued laminated timbers with connectors comprised of water-resisting multilayer plywood. The paper describes a novel timber configuration, which reduces the weight of one square meter area by 55% compared with an ordinary timber having a cross-section of 0.21 m Ч 0.21 m and saves not less than 60% of wood. The latter is highly relevant because forests remove carbon dioxide emissions from the atmosphere; reducing the use of wood in construction is of great importance for ecology. The ANSYS finite element program is used for calculating temperature fields and heat fluxes. It is found that one connector affects not more than 0.2 m of the exterior wall length in relation to the temperature and heat flux fields, whereas the heat loss increase is not over 0.44%.
Sprache:Englisch
Veröffentlicht: 2021
Schlagworte:
электронный ресурс
труды учёных ТПУ
Online-Zugang:https://doi.org/10.1088/1755-1315/866/1/012037
Format: Elektronisch Buchkapitel
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=668008

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