Graphic measurement programming and creation of laboratory works for engineering education; Measurement - Supports Science - Improves Technology - Protects Environment ... and Provides Employment - Now and in the Future

Graphic measurement programming and creation of laboratory works for engineering education; Measurement - Supports Science - Improves Technology - Protects Environment ... and Provides Employment - Now and in the Future

Opis bibliograficzny
Parent link:	Measurement - Supports Science - Improves Technology - Protects Environment ... and Provides Employment - Now and in the Future.— 2000.— [6 р.]
1. autor:	Muravyov (Murav’ev) S. V. Sergey Vasilyevich
Korporacja:	Национальный исследовательский Томский политехнический университет (ТПУ) Институт кибернетики (ИК) Кафедра компьютерных измерительных систем и метрологии (КИСМ)
Kolejni autorzy:	Komarov A. V., Savolainen V.
Streszczenie:	Title screen In the educational process in the field of electronics and electrical engineering a breadboard method has been employing for implementing a laboratory practicum. The typical breadboard consists of kits of active and passive electrical network elements and a set of measuring instruments. Following this approach the student has to manipulate real network components which, however, are hidden inside the breadboard, and only their images on the breadboard's switching panel are within the student's reach. The demerit of the approach is that both breadboards and instruments are rather expensive and quite often become disabled. In this paper it is shown how this disadvantage can be avoided by using virtual instruments of the graphic software package LabVIEW
Język:	angielski
Wydane:	2000
Hasła przedmiotowe:	электронный ресурс труды учёных ТПУ virtual instrumentation laboratory work engineering disciplines виртуальная инженерия лабораторные работы инженерные дисциплины
Dostęp online:	https://www.imeko.org/publications/wc-2000/IMEKO-WC-2000-TC1-P018.pdf
Format:	Elektroniczne Rozdział
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=666456

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