Constructive approach to reduce the influence of temperature on spring suspension eigenfrequencies; Sensor Review; Vol. 40, iss. 3

Constructive approach to reduce the influence of temperature on spring suspension eigenfrequencies; Sensor Review; Vol. 40, iss. 3

Detaylı Bibliyografya
Parent link:Sensor Review
Vol. 40, iss. 3.— 2020.— [P. 297-309]
Müşterek Yazar: Национальный исследовательский Томский политехнический университет Инженерная школа неразрушающего контроля и безопасности Отделение электронной инженерии
Diğer Yazarlar: Baranov P. F. Pavel Fedorovich, Nesterenko T. G. Tamara Georgievna, Barbin E. S. Evgeny Sergeevich, Koleda A. N. Aleksey Nikolaevich
Özet:Title screen
One of the problems encountered by developers of inertial systems, such as gyroscopes and accelerometers, is the critical dependence of the eigenfrequencies of elastic suspensions (ES) on temperature when using substrates for sensors made of dielectric materials, such as borosilicate glass. The internal stresses arising in the ES caused by the difference in the temperature coefficients of linear expansion (TCLE) lead to deformation of the sensor and complication of the electronic part of the sensor. The purpose of this paper is to approach for in-plane and out-of-plane ES are considered that allow for minimization of the influence of internal stresses on eigenfrequencies. Analytical, finite element and experimental results are considered. The temperature coefficient of thermal expansion, the Young’s modulus and the Poisson ratio are given as a function of temperature. The shape of the spring elements (SEs) and the construction of the elastic suspension are the main topics of focus in this study. The authors’ out-of-plane ES based on a meander-like spring element implemented via finite element modeling show good agreement with the experimental results.
Режим доступа: по договору с организацией-держателем ресурса
Dil:İngilizce
Baskı/Yayın Bilgisi: 2020
Konular:
электронный ресурс
труды учёных ТПУ
Online Erişim:https://doi.org/10.1108/SR-11-2019-0290
Materyal Türü: Elektronik Kitap Bölümü
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=665408

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