Thermoelectric Quality Control of the Application of Heat-Conducting Compound: Chap.; Progress in Material Science and Engineering; Vol. 351 : Studies in Systems, Decision and Control (SSDC)

Thermoelectric Quality Control of the Application of Heat-Conducting Compound: Chap.; Progress in Material Science and Engineering; Vol. 351 : Studies in Systems, Decision and Control (SSDC)

Détails bibliographiques
Parent link:	Progress in Material Science and Engineering/ eds. I. V. Minin, S. Uchaikin, A. Rogachev, O. Stary Vol. 351 : Studies in Systems, Decision and Control (SSDC).— 2021.— [P. 59-68]
Collectivité auteur:	Национальный исследовательский Томский политехнический университет Инженерная школа неразрушающего контроля и безопасности Отделение электронной инженерии
Autres auteurs:	Vasiliev I. Ivan, Soldatov A. I. Aleksey Ivanovich, Abouellail A. A. S. A. R. Ahmed Ali Sabri Ahmed Refaat, Kostina M. A. Maria Alekseevna, Soldatov A. A. Andrey Alekseevich, Soldatov D. A. Dmitry Alekseevich, Bortalevich S. I. Svetlana Ivanovna
Résumé:	Title screen The article presents the results of experiments to determine the dependence of thermopower on the quality of applying a heat-conducting compound. The data of deposition quality of the heat-conducting compound, which is obtained by thermocouples, coincides with the data, which is obtained using thermopower, but with a slight deviation due to the intrinsic inertia of thermocouples and fluctuations in the ambient temperature. The analysis of the data revealed that the value of the emerging thermopower increases linearly with the deterioration of the quality of the thermal interface application. Режим доступа: по договору с организацией-держателем ресурса
Langue:	anglais
Publié:	2021
Sujets:	электронный ресурс труды учёных ТПУ
Accès en ligne:	https://doi.org/10.1007/978-3-030-68103-6_6
Format:	MixedMaterials Électronique Chapitre de livre
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=665049

Internet

https://doi.org/10.1007/978-3-030-68103-6_6