Control of Quality of Applying Heat-Conducting Compound

Control of Quality of Applying Heat-Conducting Compound

Detalhes bibliográficos
Parent link:Russian Journal of Nondestructive Testing
Vol. 56, iss. 3.— 2020.— [P. 284-290]
Autor Corporativo: Национальный исследовательский Томский политехнический университет Инженерная школа неразрушающего контроля и безопасности Отделение электронной инженерии
Outros Autores: Soldatov A. A. Andrey Alekseevich, Dementjev A. A. Aleksandr Aleksandrovich, Soldatov A. I. Aleksey Ivanovich, Vasiljev I. M. Ivan Mikhaylovich
Resumo:Title screen
A mathematical model is proposed for determining the quality of applying a heat-conducting compound, and simulation results are presented. The model is based on the theory of heat transfer in a solid. The model has been verified using experimental data obtained by measuring the temperature at the points of contact of two bodies using thermocouples. It is shown that the data obtained using thermocouples coincide with the data obtained using thermopower.
Режим доступа: по договору с организацией-держателем ресурса
Idioma:inglês
Publicado em: 2020
Assuntos:
электронный ресурс
труды учёных ТПУ
thermopower
Seebeck effect
thermal resistance
thermal interface
heat transfer
эффект Зеебека
тепловое сопротивление
теплопередача
Acesso em linha:https://doi.org/10.1134/S1061830920030110
Formato: Recurso Electrónico Capítulo de Livro
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=662282

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