Nanoindentation on coarse-grained (CG) and ultrafine-grained (UFG) C11000 grade copper; AIP Conference Proceedings; Vol. 2167 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2019 (AMHS'19)
| Parent link: | AIP Conference Proceedings Vol. 2167 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2019 (AMHS'19).— 2019.— [020103, 4 p.] |
|---|---|
| Glavni autor: | Filippov A. V. |
| Autor kompanije: | Национальный исследовательский Томский политехнический университет Инженерная школа новых производственных технологий Отделение материаловедения |
| Daljnji autori: | Tarasov S. Yu. Sergei Yulievich |
| Sažetak: | Title screen The microstructures and nanoindentation characteristics of CG and ECAP UFG C11000 grade copper were investigated. It was found that all indentations demonstrated the presence of pile-ups, whose heights reduced as a function of the ECAP pass number. The pile-up height on the CG sample was less than that of the 1-pass ECAP sample but higher than those of 4- and 12-pass ECAP ones. The maximum hardness and elasticity modulus values were achieved after 12-pass ECAP. Режим доступа: по договору с организацией-держателем ресурса |
| Jezik: | engleski |
| Izdano: |
2019
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| Teme: | |
| Online pristup: | https://doi.org/10.1063/1.5131970 |
| Format: | MixedMaterials Elektronički Poglavlje knjige |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=661486 |
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