Nanoindentation on coarse-grained (CG) and ultrafine-grained (UFG) C11000 grade copper; AIP Conference Proceedings; Vol. 2167 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2019 (AMHS'19)

Bibliografski detalji
Parent link:AIP Conference Proceedings
Vol. 2167 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2019 (AMHS'19).— 2019.— [020103, 4 p.]
Glavni autor: Filippov A. V.
Autor kompanije: Национальный исследовательский Томский политехнический университет Инженерная школа новых производственных технологий Отделение материаловедения
Daljnji autori: Tarasov S. Yu. Sergei Yulievich
Sažetak:Title screen
The microstructures and nanoindentation characteristics of CG and ECAP UFG C11000 grade copper were investigated. It was found that all indentations demonstrated the presence of pile-ups, whose heights reduced as a function of the ECAP pass number. The pile-up height on the CG sample was less than that of the 1-pass ECAP sample but higher than those of 4- and 12-pass ECAP ones. The maximum hardness and elasticity modulus values were achieved after 12-pass ECAP.
Режим доступа: по договору с организацией-держателем ресурса
Jezik:engleski
Izdano: 2019
Teme:
Online pristup:https://doi.org/10.1063/1.5131970
Format: MixedMaterials Elektronički Poglavlje knjige
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=661486

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