Improvement of Thermal Cycling Resistance of AlxSi1−xN Coatings on Cu Substrates by Optimizing Al/Si Ratio; Materials; Vol. 12, iss. 14

Improvement of Thermal Cycling Resistance of AlxSi1−xN Coatings on Cu Substrates by Optimizing Al/Si Ratio; Materials; Vol. 12, iss. 14

Bibliographic Details
Parent link:Materials
Vol. 12, iss. 14.— 2019.— [2249, 12 p.]
Other Authors: Panin A. V. Alexey Viktorovich, Shugurov A. R. Artur Rubinovich, Kazachenok M. S. Marina Sergeevna, Sergeev V. P. Viktor Petrovich
Summary:Title screen
The effect of the elemental composition of AlxSi1−xN coatings deposited on Cu substrates by magnetron sputtering on their structure, mechanical properties and thermal cycling performance is studied. The coatings with Al-Si-N solid solution, two-phase (AlxSi1−xN nanocrystallites embedded in the SixNy tissue phase) and amorphous structure were obtained by varying Al/Si ratio. It is shown that polycrystalline coatings with a low Si content (Al0.88Si0.12N) are characterized by the highest thermal cycling resistance. While the coatings with a high and intermediate Si content (Al0.11Si0.89N and Al0.74Si0.26N) were subjected to cracking and spallation after the first cycle of annealing at a temperature of 1000 ◦C, delamination of the Al0.88Si0.12N coating was observed after 25 annealing cycles. The Al0.88Si0.12N coating also exhibited the best barrier performance against copper diffusion from the substrate. The effect of thermal stresses on the diffusion barrier performance of the coatings against copper diffusion is discussed.
Language:English
Published: 2019
Subjects:
электронный ресурс
труды учёных ТПУ
copper
magnetron sputtering
thermal cycling performance
scanning electron microscopy
cracking
медь
магнетронные покрытия
Online Access:http://earchive.tpu.ru/handle/11683/57276
https://doi.org/10.3390/ma12142249
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=660974

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