Improvement of Thermal Cycling Resistance of AlxSi1−xN Coatings on Cu Substrates by Optimizing Al/Si Ratio

Improvement of Thermal Cycling Resistance of AlxSi1−xN Coatings on Cu Substrates by Optimizing Al/Si Ratio

গ্রন্থ-পঞ্জীর বিবরন
Parent link:Materials
Vol. 12, iss. 14.— 2019.— [2249, 12 p.]
অন্যান্য লেখক: Panin A. V. Alexey Viktorovich, Shugurov A. R. Artur Rubinovich, Kazachenok M. S. Marina Sergeevna, Sergeev V. P. Viktor Petrovich
সংক্ষিপ্ত:Title screen
The effect of the elemental composition of AlxSi1−xN coatings deposited on Cu substrates by magnetron sputtering on their structure, mechanical properties and thermal cycling performance is studied. The coatings with Al-Si-N solid solution, two-phase (AlxSi1−xN nanocrystallites embedded in the SixNy tissue phase) and amorphous structure were obtained by varying Al/Si ratio. It is shown that polycrystalline coatings with a low Si content (Al0.88Si0.12N) are characterized by the highest thermal cycling resistance. While the coatings with a high and intermediate Si content (Al0.11Si0.89N and Al0.74Si0.26N) were subjected to cracking and spallation after the first cycle of annealing at a temperature of 1000 ◦C, delamination of the Al0.88Si0.12N coating was observed after 25 annealing cycles. The Al0.88Si0.12N coating also exhibited the best barrier performance against copper diffusion from the substrate. The effect of thermal stresses on the diffusion barrier performance of the coatings against copper diffusion is discussed.
প্রকাশিত: 2019
বিষয়গুলি:
электронный ресурс
труды учёных ТПУ
copper
magnetron sputtering
thermal cycling performance
scanning electron microscopy
cracking
медь
магнетронные покрытия
অনলাইন ব্যবহার করুন:http://earchive.tpu.ru/handle/11683/57276
https://doi.org/10.3390/ma12142249
বিন্যাস: বৈদ্যুতিক গ্রন্থের অধ্যায়
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=660974

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