Influence of Technological Process for Microelectromechanical Sensors Manufacturing on their Technical Characteristics; Materials Science Forum; Vol. 970 : Modern Problems in Materials Processing, Manufacturing, Testing and Quality Assurance II

Influence of Technological Process for Microelectromechanical Sensors Manufacturing on their Technical Characteristics; Materials Science Forum; Vol. 970 : Modern Problems in Materials Processing, Manufacturing, Testing and Quality Assurance II

Bibliographic Details
Parent link:	Materials Science Forum: Scientific Journal Vol. 970 : Modern Problems in Materials Processing, Manufacturing, Testing and Quality Assurance II.— 2019.— [P. 123-129]
Main Author:	Nesterenko T. G. Tamara Georgievna
Corporate Author:	Национальный исследовательский Томский политехнический университет Инженерная школа неразрушающего контроля и безопасности Отделение электронной инженерии
Other Authors:	Barbin E. S. Evgeny Sergeevich, Koleda A. N. Aleksey Nikolaevich
Summary:	Title screen The article discusses the technological process for MEMS sensors manufacturing, which provides the minimum allowable technological defects to achieve MEMS technical characteristics. The paper deals with experiments on the definition of technological operations and the choice of their parameters. The factors influencing the size of technological defects are revealed. There is a technology to manufacture MEMS considered as "silicon on glass." There were successful experiments with the use of mask thickness of 540 nm and 450 nm. The slope of the faces does not exceed 1o, the maximum height of the surface roughness profile was 75 nm. Режим доступа: по договору с организацией-держателем ресурса
Language:	English
Published:	2019
Subjects:	электронный ресурс труды учёных ТПУ Glass Etching Gold Sputtering MEMS Photoresist Silicon Oxide Mask Technological Errors травление стекла золотые покрытия напыления фоторезисторы датчики технологические процессы дефекты шероховатости
Online Access:	https://doi.org/10.4028/www.scientific.net/MSF.970.123
Format:	Electronic Book Chapter
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=660926

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