Research of Method About the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet; Actual Problems of Electronic Instrument Engineering (APEIE-2018); Vol. 1, pt. 1

Research of Method About the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet; Actual Problems of Electronic Instrument Engineering (APEIE-2018); Vol. 1, pt. 1

Dettagli Bibliografici
Parent link:Actual Problems of Electronic Instrument Engineering (APEIE-2018): Proceedings of 14th International Scientific-Technical Conference, Novosibirsk, October 2-6, 2018/ Novosibirsk State Technical University.— , 2018
Vol. 1, pt. 1.— 2018.— [P. 132-136]
Autore principale: Sivkov A. A. Aleksandr Anatolyevich
Ente Autore: Национальный исследовательский Томский политехнический университет Инженерная школа энергетики Отделение электроэнергетики и электротехники (ОЭЭ)
Altri autori: Shanenkova Yu. L. Yuliya Leonidovna, Polovinkina Yu. N. Yuliya Nikolaevna
Riassunto:Title screen
The problem of coupling the heterogeneous materials has always been urgent. There are a lot of ways to solve this problem, but all of them have a number of disadvantages such as high costs, insecurity, etc. The plasma dynamic method is considered as the one of up-to-date solutions. This method allows coupling the heterogeneous materials (for example copper and aluminum, which are the most widely-used material in power engineering), in order to reduce energy losses in the transient contact resistance, by depositing copper on the aluminum contact surface using a coaxial magneto plasma accelerator. In process the accelerator generates a high-speed pulse jet of copper electric erosion plasma, which at high speeds affects the surface of aluminum substrate. A special setup was designed and constructed to determine and calculate the specific transient contact resistance of the obtained contact pairs. The obtained results show the possibility of combining copper and aluminum by depositing a copper coating on aluminum substrate using the plasma dynamic method. The proposed method allows not only coupling copper and aluminum, but also reducing the contact resistance, thereby reducing the energy losses in the transient contacts.
Режим доступа: по договору с организацией-держателем ресурса
Lingua:inglese
Pubblicazione: 2018
Soggetti:
электронный ресурс
труды учёных ТПУ
copper coating
aluminum substrate
coaxial magneto plasma accelerator
transient contact resistance
voltage deviation
медные покрытия
коаксиальные магнитоплазменные ускорители
контактное сопротивление
отклонения напряжения
Accesso online:https://doi.org/10.1109/APEIE.2018.8545357
Natura: Elettronico Capitolo di libro
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=659452

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