Numerical Modeling of Thermal Processes while Depositing Layers in Additive Production; Materials Science Forum; Vol. 938 : Materials and Technologies in Mechanical Engineering

Бібліографічні деталі
Parent link:Materials Science Forum: Scientific Journal
Vol. 938 : Materials and Technologies in Mechanical Engineering.— 2018.— [P. 54-61]
Співавтори: Национальный исследовательский Томский политехнический университет (ТПУ) Юргинский технологический институт (филиал) (ЮТИ) Отделение промышленных технологий (ОПТ), Национальный исследовательский Томский политехнический университет (ТПУ) Юргинский технологический институт (филиал) (ЮТИ) Отделение цифровых технологий (ОЦТ)
Інші автори: Kuznetsov M. A. Maksim Aleksandrovich, Krampit M. A. Maksim Andreevich, Kryukov A. V. Artem Viktorovich, Kust T. S. Tatiana Sergeevna, Pavlov N. V. Nikolay Viktorovich
Резюме:Title screen
The up to date industry tends to introduce additive technologies in all fields of production, since their use furthers manufacturing of sufficiently qualitative products in a quite quick and economical way.As a consequence, it is still a topical issue how to control quality of the output products.The paper reports on a numerical model of thermal processes in a substrate plate and in a product while depositing.Temperature distribution patterns and a penetration form of a substrate plate are considered for the entire process of deposition.
Режим доступа: по договору с организацией-держателем ресурса
Мова:Англійська
Опубліковано: 2018
Предмети:
Онлайн доступ:https://doi.org/10.4028/www.scientific.net/MSF.938.54
Формат: Електронний ресурс Частина з книги
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=659385
Опис
Резюме:Title screen
The up to date industry tends to introduce additive technologies in all fields of production, since their use furthers manufacturing of sufficiently qualitative products in a quite quick and economical way.As a consequence, it is still a topical issue how to control quality of the output products.The paper reports on a numerical model of thermal processes in a substrate plate and in a product while depositing.Temperature distribution patterns and a penetration form of a substrate plate are considered for the entire process of deposition.
Режим доступа: по договору с организацией-держателем ресурса
DOI:10.4028/www.scientific.net/MSF.938.54