Numerical Modeling of Thermal Processes while Depositing Layers in Additive Production; Materials Science Forum; Vol. 938 : Materials and Technologies in Mechanical Engineering

Détails bibliographiques
Parent link:Materials Science Forum: Scientific Journal
Vol. 938 : Materials and Technologies in Mechanical Engineering.— 2018.— [P. 54-61]
Collectivités auteurs: Национальный исследовательский Томский политехнический университет (ТПУ) Юргинский технологический институт (филиал) (ЮТИ) Отделение промышленных технологий (ОПТ), Национальный исследовательский Томский политехнический университет (ТПУ) Юргинский технологический институт (филиал) (ЮТИ) Отделение цифровых технологий (ОЦТ)
Autres auteurs: Kuznetsov M. A. Maksim Aleksandrovich, Krampit M. A. Maksim Andreevich, Kryukov A. V. Artem Viktorovich, Kust T. S. Tatiana Sergeevna, Pavlov N. V. Nikolay Viktorovich
Résumé:Title screen
The up to date industry tends to introduce additive technologies in all fields of production, since their use furthers manufacturing of sufficiently qualitative products in a quite quick and economical way.As a consequence, it is still a topical issue how to control quality of the output products.The paper reports on a numerical model of thermal processes in a substrate plate and in a product while depositing.Temperature distribution patterns and a penetration form of a substrate plate are considered for the entire process of deposition.
Режим доступа: по договору с организацией-держателем ресурса
Langue:anglais
Publié: 2018
Sujets:
Accès en ligne:https://doi.org/10.4028/www.scientific.net/MSF.938.54
Format: Électronique Chapitre de livre
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=659385
Description
Résumé:Title screen
The up to date industry tends to introduce additive technologies in all fields of production, since their use furthers manufacturing of sufficiently qualitative products in a quite quick and economical way.As a consequence, it is still a topical issue how to control quality of the output products.The paper reports on a numerical model of thermal processes in a substrate plate and in a product while depositing.Temperature distribution patterns and a penetration form of a substrate plate are considered for the entire process of deposition.
Режим доступа: по договору с организацией-держателем ресурса
DOI:10.4028/www.scientific.net/MSF.938.54