Structural-Phase State and Mechanical Properties of the Surface Layer of the Copper Modified by Titanium Ions; AIP Conference Proceedings; Vol. 2051 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2018 (AMHS’18)

Structural-Phase State and Mechanical Properties of the Surface Layer of the Copper Modified by Titanium Ions; AIP Conference Proceedings; Vol. 2051 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2018 (AMHS’18)

Dades bibliogràfiques
Parent link:	AIP Conference Proceedings Vol. 2051 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2018 (AMHS’18).— 2018.— [020082, 4 p.]
Autor corporatiu:	Национальный исследовательский Томский политехнический университет Инженерная школа новых производственных технологий Отделение материаловедения
Altres autors:	Fedorishcheva M. V. Marina Vladimirovna, Kalashnikov M. P. Mark Petrovich, Bozhko I. A. Irina Aleksandrovna, Sergeev V. P. Viktor Petrovich
Sumari:	Title screen The results of investigation of the surface of a copper substrate modified by titanium ions are presented. Using TEM it has been established that a two-level micro- and nanoporous nanocrystalline structure is formed due to simultaneous ion etching, heating, radiation-stimulated diffusion in the surface layer of the metal substrate. When bombarded with titanium ions the phases of the equilibrium diagram of the Cu-Ti were formed with a characteristic dimension of the elements of the intermetallic "net" structure of 1-4 [mu]m in size. The mechanical properties of the surface layer of the copper modified by titanium ions are studied. Режим доступа: по договору с организацией-держателем ресурса
Idioma:	anglès
Publicat:	2018
Matèries:	электронный ресурс труды учёных ТПУ структурно-фазовые состояния механические свойства поверхностные слои медь ионы титана медные подложки ионное травление нагрев диффузия
Accés en línia:	https://doi.org/10.1063/1.5083325
Format:	Electrònic Capítol de llibre
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=659164

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