Al2O3/Cu-O composites fabricated by pressureless infiltration of paper-derived Al2O3 porous preforms

Detalles Bibliográficos
Parent link:Ceramics International.— , 1981-
Vol. 44, iss. 17.— 2018.— [P. 20835-20840]
Autor Corporativo: Национальный исследовательский Томский политехнический университет Инженерная школа новых производственных технологий Отделение материаловедения
Otros Autores: Pfeiffer S. Stefan, Lorenz H. Hannes, Fu Z. Zongwen, Fey T. Tobias, Greil P. Peter, Travitsky N. Nakhum
Sumario:Title screen
Al2O3/Cu-O composites were fabricated from the paper-derived alumina matrix infiltrated with a Cu-3.2 wt% O alloy. Paper-derived alumina preforms with an open porosity ranging from ∼ 14 to ∼ 25 vol% were prepared by sintering of alumina-loaded preceramic papers at 1600 °C for 4 h. Pressureless infiltration at 1320 °C for 4 h of the preforms with Cu-O alloy resulted in the nearly dense materials with good mechanical and electrical properties, e.g. fracture toughness up to 6 MPa m0.5, four-point-bending strength up to 342 MPa, Young's modulus up to 281 GPa and electrical conductivity up to 2 MS/m depending on the volume fraction of copper alloy in the composites. The technological capability of this approach was demonstrated using prototypes in various engineering fields fabricated by lamination, corrugating and Laminated Object Manufacturing (LOM) methods.
Режим доступа: по договору с организацией-держателем ресурса
Lenguaje:inglés
Publicado: 2018
Materias:
Acceso en línea:https://doi.org/10.1016/j.ceramint.2018.08.087
Formato: Electrónico Capítulo de libro
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=659057
Descripción
Sumario:Title screen
Al2O3/Cu-O composites were fabricated from the paper-derived alumina matrix infiltrated with a Cu-3.2 wt% O alloy. Paper-derived alumina preforms with an open porosity ranging from ∼ 14 to ∼ 25 vol% were prepared by sintering of alumina-loaded preceramic papers at 1600 °C for 4 h. Pressureless infiltration at 1320 °C for 4 h of the preforms with Cu-O alloy resulted in the nearly dense materials with good mechanical and electrical properties, e.g. fracture toughness up to 6 MPa m0.5, four-point-bending strength up to 342 MPa, Young's modulus up to 281 GPa and electrical conductivity up to 2 MS/m depending on the volume fraction of copper alloy in the composites. The technological capability of this approach was demonstrated using prototypes in various engineering fields fabricated by lamination, corrugating and Laminated Object Manufacturing (LOM) methods.
Режим доступа: по договору с организацией-держателем ресурса
DOI:10.1016/j.ceramint.2018.08.087